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532nm Q-switched DPSS Lasers
For customers who require a compact, efficient, precision laser ideal for a variety of OEM, materials processing and scientific applications.
RMI's UP-series DPSS lasers feature single mode (TEM00) beam operation and the shortest Q-switch pulse duration in their class. This results in a higher energy density, higher peak power and better materials processing than with competing systems.
- Easy Integration
Laser control is available through the controller using the following options:
• Easy to use front panel controls
• RS232 serial communication
• Analog current control for pump diode (0-10V)
• Analog First Pulse Suppression control (0-5V)
• Programmable digital I/O’s (PLC – compatible)
• Digital pulse triggering
• External first pulse suppression
• Remote interlock
• Firmware update in the field through RS232
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1064nm Q-Switched Diode-Pumped Solid State Laser
| UP-5 |
5 Watts |
| UP-10 |
10 Watts |
| UP-20 |
20 Watts |
For customers who require a compact, efficient, precision laser without the marking head, scanner or marking software, ideal for a variety of OEM, Materials Processing and Scientific Applications
RMI DPSS Laser Systems feature single mode (TEM00) beam operation and the shortest Q-Switch pulse duration in their class. This results in a higher energy density, higher peak power and better materials processing than with competing systems.
- Easy Integration: Hardware and Software
Laser control is available through the controller using the following options:
• Easy to use front panel controls
• RS232 serial communication
• Analog current control for pump diode (0-10V)
• Analog FPS control for laser source (0-5V)
• Programmable digital I/O’s (PLC – compatible)
• Digital pulse triggering
• External first pulse suppression
• Remote interlock
• Firmware update in the field through RS232
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Output Characteristics
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UP-3G
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UP-6G
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UP-5
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UP-10
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UP-20
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Laser Output Wavelength [nm]
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532nm
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1064nm
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Maximum Average Power [W]
@ 40 kHz
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>3
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>6
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5 (CW)
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10 (CW)
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>20 (CW)
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Pulse Width2 [ns] @10 kHz
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~14
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~14
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~15
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~10
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~7
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Peak Power2 up to [kW]
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15
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30
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30
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70
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150
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Pulse Energy2 up to [μJ]
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130
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300
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300
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500
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1000
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Frequency Range [kHz]
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10 - 200
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1 - 200
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10 - 200
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Mode2
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TEM00
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Beam Quality2 (M2)
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~ 1.3
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Beam Ellipticity2[%]
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< 10%
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< 20%
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< 10%
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Beam Pointing Stability2 [mrad]
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< 0.1
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Polarization3
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> 1:100 horizontal
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Beam Diameter at output [mm]
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0.5
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Beam Divergence, full angle2 [mrad]
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< 2.5
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< 3
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< 2.5
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< 3
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< 3
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Short Term Stability2 [%]
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2.5
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Physical Characteristics
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Controller
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17.1" x 17.5" x 5.2" (433 mm x 445 mm x 133 mm)
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Resonator
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7" x 5.75" x 4.15" (178 mm x 146 mm x 105 mm)
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Fiber Length
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Standard 2 m (up to 10 m)
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Controller Weight
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25.2 lbs (11.5 kg)
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25.2 lbs (11.5 kg)
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32.7 (14.8 kg)
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Resonator Weight
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6.5 lbs (2.9 kgs)
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6 lbs (2.7 kgs)
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10 (4.5 kg)
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Environment
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Operating Temperature Range
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50°F - 104°F (10°C - 40°C)
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Operating Humidity Range
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0 - 80% non-condensing
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Warm up time (cold start) [min]
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~ 5
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Warm up time (warm start) [min]
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~ 0.5
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Maximum operating altitude
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<6600'' (2000 m)
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Transport temperature range
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+131°F -58°F (+55°C -50°C)
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532 nm Q-switched DPSS Lasers
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1064nm Q-Switched DPSS Lasers
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Solar Cell Scribing
Scribing on conductive films used in thin film solar cells is often achieved with 532 nm laser scribing. Machines used to accomplish this can accommodate very large photovoltaic cells and rapidly scribe the conductive film by using multiple heads. The manufacturing process can also involve laser micro-drilling and cutting operations using the same equipment.
Flow Cytometry
Flow cytometry is a diagnostic tool most commonly used to count or separate individual cells in order to analyze their pathologic or genetic characteristics. This involves using a 532 nm DPSS laser used in its cw or continuous wave mode in combination with a fluorescent dye.
Retinal Surgery
Photocoagulation uses a pattern scan laser system designed to treat retinal diseases. This technology employs short 532 nm laser pulses. These laser pulses are delivered in a predetermined sequence which results in improved precision, patient safety & comfort, and a significant reduction in treatment time compared with other methods.
Silicon Wafer Processing
532 nm lasers are used in wafer processing in a variety of applications including scribing, cutting and microdrilling as well as for impurity removal.
Forensics
A portable system using a modified 532 nm laser is currently being employed by criminologists and forensics experts. It can be used to locate fingerprints, fibers, body fluids, bone fragments, tooth chips, narcotics residue, and a variety of other types of trace evidence even in high ambient light conditions.
Stereolithography & Rapid prototyping
Stereolithography, also known as 3-D layering or rapid prototyping, involves the creation of plastic three-dimensional objects quickly and accurately from CAD drawings using plastic resin and a 532 nm DPSS laser. This method allows a mechanical engineer to verify the fit of a part or an inventor to create a plastic prototype of an invention in a matter of hours.
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Resistor Trimming
The use of 1064 nm lasers in processing microelectronic devices, such as the trimming of thick and thin film resistors is well established that the laser has become a common tool for this application. This is especially true for high-volume, high-accuracy trimming operations.
Spectroscopy
Raman scattering is a valuable spectroscopic technique having a number of applications involving solid, liquid or gas samples. The Raman effect occurs when a sample is irradiated with 1064 nm (cw) laser light and a small fraction of the radiation scattered from the sample exhibits shifted frequencies that correspond to the sample's vibrational transitions.
Manufacture of OEM Marking Equipment
One of the largest uses for 1064 nm DPSS lasers is for incorporation into laser marking equipment, since most marker manufacturers do not manufacture the lasers themselves. RMI Laser is one of the most highly respected suppliers of 1064nm laser platforms for this purpose. Please contact our in-house integration department for more information.
Solar Cell Scribing
Scribing on conductive films used in thin film solar cells is often achieved with 1064 nm laser scribing. Machines used to accomplish this can accommodate very large photovoltaic cells and rapidly scribe the conductive film by using multiple heads. The manufacturing process can also involve laser micro-drilling and cutting operations in silicon using the same equipment.
Silicon Wafer Processing
1064 nm lasers are used in wafer processing in a variety of applications including scribing, cutting and microdrilling as well as for impurity removal.
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